Calculation of temperature fields of bodies in sliding contact without lubrication

Hui Chen*, Yuanzhong Hu, Hui Wang, Wenzhong Wang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

3 引用 (Scopus)

摘要

A model was established to predict the frictional heat generation and conduction for bodies in sliding contact without lubrication to calculate the local temperature rise that greatly influences the glue, wear, and local plastic deformation. Fast Fourier transforms were used to solve the Laplacian equation of heat conduction. The analysis predicted the transient temperature rises of smooth and rough surfaces and the temperatures of discrete points in the half-infinite bodies in contact without lubrication. The results indicate that the frictional heat generation and thermal conduction are directly related to the local contact pressure, friction coefficient, and relative sliding speed. The results also show that the transient temperature rise of a rough surface is much higher than that of a smooth surface for the same load.

源语言英语
页(从-至)1962-1964
页数3
期刊Qinghua Daxue Xuebao/Journal of Tsinghua University
47
11
出版状态已出版 - 11月 2007
已对外发布

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Chen, H., Hu, Y., Wang, H., & Wang, W. (2007). Calculation of temperature fields of bodies in sliding contact without lubrication. Qinghua Daxue Xuebao/Journal of Tsinghua University, 47(11), 1962-1964.