TY - JOUR
T1 - Analysis of the two-layered mini/micro-channel heat sink based on liquid metal and water
AU - Ding, Yujie
AU - Tan, Sicong
AU - Liu, Jing
N1 - Publisher Copyright:
© 2018 International Heat Transfer Conference. All rights reserved.
PY - 2018
Y1 - 2018
N2 - In this work, a two layered mini/micro-channel heat sink based on liquid metal and water is proposed. The mini channel for liquid metal and micro channel for water were stacked together to enhance the cooling capability. The thermal performance of current design is analyzed using the three dimensional numerical simulation. The effects of different flow arrangements and heating direction on the thermal performance of the heat sink are studied under different flow rates. The results indicate that the thermal resistance and streamwise temperature rise of the counter flow arrangement with water channel layer attaching the heat source are substantially reduced. In addition, the two layered heat sink based on liquid metal and water has better heat dissipation capacity for its relatively lower thermal resistance and pumping power than the pure liquid metal and water two-layered heat sink.
AB - In this work, a two layered mini/micro-channel heat sink based on liquid metal and water is proposed. The mini channel for liquid metal and micro channel for water were stacked together to enhance the cooling capability. The thermal performance of current design is analyzed using the three dimensional numerical simulation. The effects of different flow arrangements and heating direction on the thermal performance of the heat sink are studied under different flow rates. The results indicate that the thermal resistance and streamwise temperature rise of the counter flow arrangement with water channel layer attaching the heat source are substantially reduced. In addition, the two layered heat sink based on liquid metal and water has better heat dissipation capacity for its relatively lower thermal resistance and pumping power than the pure liquid metal and water two-layered heat sink.
KW - Electronic equipment cooling
KW - Heat sink
KW - Heat transfer enhancement
KW - Liquid metal
KW - Micro/mini-channel
KW - Numerical simulation
UR - http://www.scopus.com/inward/record.url?scp=85068344117&partnerID=8YFLogxK
U2 - 10.1615/ihtc16.ctm.022493
DO - 10.1615/ihtc16.ctm.022493
M3 - Conference article
AN - SCOPUS:85068344117
SN - 2377-424X
VL - 2018-August
SP - 3655
EP - 3661
JO - International Heat Transfer Conference
JF - International Heat Transfer Conference
T2 - 16th International Heat Transfer Conference, IHTC 2018
Y2 - 10 August 2018 through 15 August 2018
ER -