Analysis of residual stress of gradient TiAlN films prepared by arc ion plating

Shi Wei Yang*, Li Yun Zeng, Yan Hua Wang, Hai Tao Liu

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

4 引用 (Scopus)

摘要

Graded (Ti, Al)N film was prepared on 1Cr11Ni2W2MoV stainless steel by arc ion plating. High temperature oxidation experiments were carried out at 700°C and 800°C. The residual stress configuration and bonding state of gradient film were analyzed. The results show that residual stress of films decreases obviously because there are five monolayers in the gradient films. Composition of these monolayers is Ti, TiN, TV, , Al0.25N, Ti0.6Al0.4N, Ti0.5Al0.5N. The composition and structure gradients contribute to the decrease of lattice mismatch and reduction of thermal expansion coefficient misfit leading to the decrease of residual stress. At high temperature, intrinsic stress relaxes and the thermal stress changes to tensile stress. The bonding states of gradient TiAIN film at room temperature and high temperature are excellent.

源语言英语
页(从-至)100-103
页数4
期刊Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment
27
3
出版状态已出版 - 6月 2006
已对外发布

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