Analysis of effect of MEMS fabrication error on the microspring mechanical property

Hua Li*, Geng Chen Shi, Guang He

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

5 引用 (Scopus)

摘要

S style microspring is a widely used micro elastic element in MEMS. The spring coefficient formulas of S style microspring in three directions were deduced by mechanical analysis method firstly, which were validated by ANSYS simulation. An S style LIGA-Ni microspring was designed and fabricated. The structure parameters error of line width, length and depth about S style microspring between the fabricated and design numbers were 4 μm, 50 μm and 24 μm separately, which were measured by a precise micro computer measuring instrument. The effects of fabrication errors of structure parameters on the mechanical performance of S style microspring were analyzed. It showed that the mechanical performance of microspring was affected by the fabrication error of microspring line width mostly, which was validated by the experiment of Tytron250 micro force test machine.

源语言英语
页(从-至)735-737+741
期刊Yadian Yu Shengguang/Piezoelectrics and Acoustooptics
31
5
出版状态已出版 - 10月 2009

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