An ultra-wideband compact tr module based on 3-D packaging

This study presents a novel four-channel tile-type T/R module which achieves excellent performances in ultra-wideband (2–12 GHz) and integrates all circuits in a super-light (25 g) and compact (27.8 × 27.8 × 12 mm³ ) mechanical structure in active phased array systems. The key advancement of this T/R module was to choose a Ball Grid Array (BGA) as the vertical interconnection and bracing between High-Temperature Co-fired Ceramic (HTCC) substrates in order to achieve a high-integration 3-D structure. Exploiting the HTCC multilayer layout, this paper presents the design and development of an ultra-wideband, compact and light, high-output power, four-channel, dual-polarization Transmit/Receive (T/R) Module. In this module, microwave circuits and power control circuits are highly integrated into electrically isolated HTCC layers or substrates, resulting in low coupling and crosstalk between signals. Furthermore, multichip assembly technology, multifunctional MMICs, and other high-integration technologies were adopted for this module. Each channel could provide more than 2 W transmit output power, more than 15 dB receive gain, and less than 5 dB receive noise figure. Every module contains four channels. The power supply and phase/amplitude conditioning of each channel can be controlled individually and showed good consistency of the amplitude and phase of all channels. The connectors of manifold port and polarization ports are all SSMP, which can achieve further integration. This module has also an automatic negative power protection function. The module has stabilized performance and mass production prospects.