TY - GEN
T1 - An Integrated Forward-View 2-Axis Mems Scanner for Compact 3D Lidar
AU - Wang, Dingkang
AU - Strassle Rojas, Stephan
AU - Shuping, Alexander
AU - Tasneem, Zaid
AU - Koppal, Sanjeev
AU - Xie, Huikai
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12/3
Y1 - 2018/12/3
N2 - This paper reports an integrated forward-view 2-Axis MEMS scanner that enables ultrasmall 3D LiDAR for applications in micro-Air vehicles (MAV). A new design of a pair of vertically-oriented 2-Axis scanning MEMS scanner is proposed and fabricated using an innovative fabrication process. Such MEMS scanners are integrated on a silicon optical bench and bent vertically to the substrate, thus forward scan is realized without any beam-folding mirrors. The mirror plate is \mathbf{0.7\ mm}\times \mathbf{0.7} mm. The measured optical scan range reaches 17° in both axes at only 4.5 V. The measured resonance frequency of the angular scanning mode is 2.2 kHz. Good optical alignment for LiDAR scanners can be achieved without extra alignment efforts. This MEMS mirror allows a forward-view LiDAR scanner to be monolithically integrated and aligned on a single chip.
AB - This paper reports an integrated forward-view 2-Axis MEMS scanner that enables ultrasmall 3D LiDAR for applications in micro-Air vehicles (MAV). A new design of a pair of vertically-oriented 2-Axis scanning MEMS scanner is proposed and fabricated using an innovative fabrication process. Such MEMS scanners are integrated on a silicon optical bench and bent vertically to the substrate, thus forward scan is realized without any beam-folding mirrors. The mirror plate is \mathbf{0.7\ mm}\times \mathbf{0.7} mm. The measured optical scan range reaches 17° in both axes at only 4.5 V. The measured resonance frequency of the angular scanning mode is 2.2 kHz. Good optical alignment for LiDAR scanners can be achieved without extra alignment efforts. This MEMS mirror allows a forward-view LiDAR scanner to be monolithically integrated and aligned on a single chip.
UR - http://www.scopus.com/inward/record.url?scp=85050214281&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2018.8557009
DO - 10.1109/NEMS.2018.8557009
M3 - Conference contribution
AN - SCOPUS:85050214281
T3 - NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
SP - 185
EP - 188
BT - NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018
Y2 - 22 April 2018 through 26 April 2018
ER -