TY - JOUR
T1 - An experimental investigation on effective friction coefficient in elliptical ultrasonic assisted grinding of monocrystal sapphire
AU - Liang, Zhiqiang
AU - Wang, Xibin
AU - Wu, Yongbo
AU - Xie, Lijing
AU - Jiao, Li
AU - Zhao, Wenxiang
PY - 2013
Y1 - 2013
N2 - In this study, in order to investigate the effective friction coefficient in elliptical ultrasonic assisted grinding (EUAG) of sapphire, the single abrasive grain scratching experiments are performed to simulate the grinding process by setting up the elliptical ultrasonic vibrator attached with the sapphire substrate on a multi-axis CNC grinder. The single grain diamond tool slides on the elliptically vibrated surface at a serial of pressures, and the grinding forces are measured. The friction coefficients under different pressure and vibration amplitude are obtained by calculating the ratio of tangential grinding force to normal grinding force, i.e., Ft /Fn. Comparing friction coefficients in both scratching with and without vibration, there is a critical pressure Fpc at a range of pressure. As the pressure is less than Fpc, the friction coefficient in EUAG is smaller than that in conventional grinding (CG), and once the increasing pressure is more than Fpc, that is much higher than that in CG. When the pressure is slight, ploughing occurs and no chips are generated, and actually at low pressure, the ratio Ft /Fn can be close to the effective friction coefficient in EUAG. Thus, the experimental results at low pressure indicate that the effective friction coefficient in EUAG is less than that in CG, and is decreasing with the increasing vibration amplitude.
AB - In this study, in order to investigate the effective friction coefficient in elliptical ultrasonic assisted grinding (EUAG) of sapphire, the single abrasive grain scratching experiments are performed to simulate the grinding process by setting up the elliptical ultrasonic vibrator attached with the sapphire substrate on a multi-axis CNC grinder. The single grain diamond tool slides on the elliptically vibrated surface at a serial of pressures, and the grinding forces are measured. The friction coefficients under different pressure and vibration amplitude are obtained by calculating the ratio of tangential grinding force to normal grinding force, i.e., Ft /Fn. Comparing friction coefficients in both scratching with and without vibration, there is a critical pressure Fpc at a range of pressure. As the pressure is less than Fpc, the friction coefficient in EUAG is smaller than that in conventional grinding (CG), and once the increasing pressure is more than Fpc, that is much higher than that in CG. When the pressure is slight, ploughing occurs and no chips are generated, and actually at low pressure, the ratio Ft /Fn can be close to the effective friction coefficient in EUAG. Thus, the experimental results at low pressure indicate that the effective friction coefficient in EUAG is less than that in CG, and is decreasing with the increasing vibration amplitude.
KW - EUAG
KW - Elliptical ultrasonic assisted grinding
KW - Friction coefficient
KW - Grinding forces
KW - Sapphire
UR - http://www.scopus.com/inward/record.url?scp=84888595665&partnerID=8YFLogxK
U2 - 10.1504/IJNM.2013.057589
DO - 10.1504/IJNM.2013.057589
M3 - Article
AN - SCOPUS:84888595665
SN - 1746-9392
VL - 9
SP - 477
EP - 485
JO - International Journal of Nanomanufacturing
JF - International Journal of Nanomanufacturing
IS - 5-6
ER -