TY - GEN
T1 - An electroporation chip based on flexible microneedle array for in vivo nucleic acid delivery
AU - Wei, Zewen
AU - Wang, Renxing
AU - Zheng, Shuquan
AU - Liang, Zicai
AU - Li, Zhihong
PY - 2014
Y1 - 2014
N2 - This paper reports a flexible microneedle array (MNA) electroporation chip for in vivo nucleic acid delivery, which is of great importance for gene therapy. Silicon MNA is proposed to penetrate the high-resistant stratum corneum, while a flexible parylene substrate is used to fit the natural shape of electroporated objects. The chip provides a sufficient electrical field beneath the skin for electroporation with low voltage, which is less likely to harm tissues. Using the proposed chip, we successfully achieved plasmid DNA expression and siRNA delivery in living tissue with low voltage (30-40V). Neither physical nor biological harm to skin was observed.
AB - This paper reports a flexible microneedle array (MNA) electroporation chip for in vivo nucleic acid delivery, which is of great importance for gene therapy. Silicon MNA is proposed to penetrate the high-resistant stratum corneum, while a flexible parylene substrate is used to fit the natural shape of electroporated objects. The chip provides a sufficient electrical field beneath the skin for electroporation with low voltage, which is less likely to harm tissues. Using the proposed chip, we successfully achieved plasmid DNA expression and siRNA delivery in living tissue with low voltage (30-40V). Neither physical nor biological harm to skin was observed.
UR - http://www.scopus.com/inward/record.url?scp=84898979720&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2014.6765766
DO - 10.1109/MEMSYS.2014.6765766
M3 - Conference contribution
AN - SCOPUS:84898979720
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 817
EP - 820
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -