An analytical dislocation multiple-pile-up model for the yield stress of fully lamellar TiAl alloys

Jun Yang*, Gengkai Hu, Yonggang Zhang, Jilong Su

*此作品的通讯作者

科研成果: 期刊稿件文献综述同行评审

摘要

An analytical dislocation multiple-pile-up model for yield stress of fully lamellar TiAl alloys was proposed. Numerical simulations showed that even when the grain size was fixed, different distributions of lamella sizes of different thickness influenced the yield stress. The proposed model agrees with the experimental results for fully lamellar TiAl alloys for relatively large lamellar thickness.

源语言英语
页(从-至)627-634
页数8
期刊Modelling and Simulation in Materials Science and Engineering
11
4
DOI
出版状态已出版 - 7月 2003

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