TY - JOUR
T1 - Alloy with low W-W contiguity
AU - Zhao, Ziying
AU - Liu, Jinxu
AU - Zhang, Hongyan
AU - Guo, Wenqi
AU - Li, Shukui
N1 - Publisher Copyright:
© 2016, Science Press. All right reserved.
PY - 2016/1/1
Y1 - 2016/1/1
N2 - Preparation and Quasistatic Mechanical Properties of 65W-25Cu-10Ni W particles were coated with Ni using an electroless plating technique, and the Ni coated W powders were mixed uniformly with copper powders. 65W-25Cu-10Ni alloy with low W-W contiguity was prepared by a SPS method using the composite powders, and the quasistatic mechanical properties were studied. The results show that after the Ni electroless plating process, Ni uniformly distributes on the surface of W particles, and the interface bonding is well. The 65W-25Cu-10Ni alloy prepared by SPS is uniform and dense in microstructure. Compared with 65W-35Cu alloy, 65W-25Cu-10Ni alloy exhibits higher strength and better ductility under quasistatic compression condition, while it presents higher strength under quasistatic tensile condition, but the ductility is not obviously improved. The analysis of the failure mechanism shows that compared with 65W-35Cu alloy, W-W contiguity evidently decreases in the 65W-25Cu-10Ni alloy, the matrix is replaced by Cu0.81Ni0.19 solid solution, and metallurgical bonding is formed between W and the matrix. All these above factors are beneficial to increase the strength of 65W-25Cu-10Ni alloy. Meanwhile, the decrease of W-W contiguity and the increase of the interfacial strength account for the ductility increase of 65W-25Cu-10Ni alloy under quasistatic compression condition.
AB - Preparation and Quasistatic Mechanical Properties of 65W-25Cu-10Ni W particles were coated with Ni using an electroless plating technique, and the Ni coated W powders were mixed uniformly with copper powders. 65W-25Cu-10Ni alloy with low W-W contiguity was prepared by a SPS method using the composite powders, and the quasistatic mechanical properties were studied. The results show that after the Ni electroless plating process, Ni uniformly distributes on the surface of W particles, and the interface bonding is well. The 65W-25Cu-10Ni alloy prepared by SPS is uniform and dense in microstructure. Compared with 65W-35Cu alloy, 65W-25Cu-10Ni alloy exhibits higher strength and better ductility under quasistatic compression condition, while it presents higher strength under quasistatic tensile condition, but the ductility is not obviously improved. The analysis of the failure mechanism shows that compared with 65W-35Cu alloy, W-W contiguity evidently decreases in the 65W-25Cu-10Ni alloy, the matrix is replaced by Cu0.81Ni0.19 solid solution, and metallurgical bonding is formed between W and the matrix. All these above factors are beneficial to increase the strength of 65W-25Cu-10Ni alloy. Meanwhile, the decrease of W-W contiguity and the increase of the interfacial strength account for the ductility increase of 65W-25Cu-10Ni alloy under quasistatic compression condition.
KW - 65W-25Cu-10Ni alloy
KW - Ni electroless plating
KW - Quasistatic mechanical properties
KW - SPS
KW - W-W contiguity
UR - http://www.scopus.com/inward/record.url?scp=84960888658&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:84960888658
SN - 1002-185X
VL - 45
SP - 182
EP - 186
JO - Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
JF - Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
IS - 1
ER -