AFG-90基固体浮力材料的固化动力学与性能研究

Si Zhu Yu; Xiao Dong Li; Mei Shuai Zou; Xiao Yan Guo; Xin Jin

doi:10.15918/j.tbit1001-0645.2018.11.017

AFG-90基固体浮力材料的固化动力学与性能研究

Si Zhu Yu, Xiao Dong Li, Mei Shuai Zou^*, Xiao Yan Guo, Xin Jin

^*此作品的通讯作者

Beijing Institute of Technology

科研成果: 期刊稿件 › 文章 › 同行评审

1 引用（Scopus）

摘要

In order to determine the curing process of N,N-diglycidyl p-aminophenol glycidyl ether epoxy resin (AFG-90)/tetrahydrophthalic anhydride (THPA), curing reaction kinetics was studied by non-isothermal differential scanning calorimetry (DSC) method, and the solid buoyancy material with hollow glass microbeads (HGM) was prepared. Results show that the best ratio of AFG-90/THPA is 1:1. The apparent activation energy (E) and pre-exponential factor (lg A) obtained by Kissinger method are 67.72 kJ•mol^-1 and 8.20 s^-1, respectively. The most probable mechanism function of curing process can be described as Avrami-Erofeev equation. The curing process is 100 ℃, 1.0 h and 125 ℃, 2.5 h. The density and compressive strength of solid buoyancy material are 0.90 g•cm^-3 and 113 MPa, respectively.

投稿的翻译标题	Study on Curing Kinetics and Properties of AFG-90 Based Solid Buoyancy Materials
源语言	繁体中文
页（从-至）	1205-1210
页数	6
期刊	Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology
卷	38
期	11
DOI	https://doi.org/10.15918/j.tbit1001-0645.2018.11.017
出版状态	已出版 - 1 11月 2018

关键词

Curing kinetics
Differential scanning calorimetry (DSC)
Epoxy resin
Solid buoyancy material

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title = "AFG-90基固体浮力材料的固化动力学与性能研究",

abstract = "In order to determine the curing process of N,N-diglycidyl p-aminophenol glycidyl ether epoxy resin (AFG-90)/tetrahydrophthalic anhydride (THPA), curing reaction kinetics was studied by non-isothermal differential scanning calorimetry (DSC) method, and the solid buoyancy material with hollow glass microbeads (HGM) was prepared. Results show that the best ratio of AFG-90/THPA is 1:1. The apparent activation energy (E) and pre-exponential factor (lg A) obtained by Kissinger method are 67.72 kJ•mol-1 and 8.20 s-1, respectively. The most probable mechanism function of curing process can be described as Avrami-Erofeev equation. The curing process is 100 ℃, 1.0 h and 125 ℃, 2.5 h. The density and compressive strength of solid buoyancy material are 0.90 g•cm-3 and 113 MPa, respectively.",

keywords = "Curing kinetics, Differential scanning calorimetry (DSC), Epoxy resin, Solid buoyancy material",

author = "Yu, {Si Zhu} and Li, {Xiao Dong} and Zou, {Mei Shuai} and Guo, {Xiao Yan} and Xin Jin",

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AU - Yu, Si Zhu

AU - Li, Xiao Dong

AU - Zou, Mei Shuai

AU - Guo, Xiao Yan

AU - Jin, Xin

PY - 2018/11/1

Y1 - 2018/11/1

N2 - In order to determine the curing process of N,N-diglycidyl p-aminophenol glycidyl ether epoxy resin (AFG-90)/tetrahydrophthalic anhydride (THPA), curing reaction kinetics was studied by non-isothermal differential scanning calorimetry (DSC) method, and the solid buoyancy material with hollow glass microbeads (HGM) was prepared. Results show that the best ratio of AFG-90/THPA is 1:1. The apparent activation energy (E) and pre-exponential factor (lg A) obtained by Kissinger method are 67.72 kJ•mol-1 and 8.20 s-1, respectively. The most probable mechanism function of curing process can be described as Avrami-Erofeev equation. The curing process is 100 ℃, 1.0 h and 125 ℃, 2.5 h. The density and compressive strength of solid buoyancy material are 0.90 g•cm-3 and 113 MPa, respectively.

AB - In order to determine the curing process of N,N-diglycidyl p-aminophenol glycidyl ether epoxy resin (AFG-90)/tetrahydrophthalic anhydride (THPA), curing reaction kinetics was studied by non-isothermal differential scanning calorimetry (DSC) method, and the solid buoyancy material with hollow glass microbeads (HGM) was prepared. Results show that the best ratio of AFG-90/THPA is 1:1. The apparent activation energy (E) and pre-exponential factor (lg A) obtained by Kissinger method are 67.72 kJ•mol-1 and 8.20 s-1, respectively. The most probable mechanism function of curing process can be described as Avrami-Erofeev equation. The curing process is 100 ℃, 1.0 h and 125 ℃, 2.5 h. The density and compressive strength of solid buoyancy material are 0.90 g•cm-3 and 113 MPa, respectively.

KW - Curing kinetics

KW - Differential scanning calorimetry (DSC)

KW - Epoxy resin

KW - Solid buoyancy material

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M3 - 文章

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JO - Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology

JF - Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology

IS - 11

ER -

AFG-90基固体浮力材料的固化动力学与性能研究

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