摘要
A two-step rapid thermal annealing process was optimized to activate magnesium doped gallium nitride layer (P-GaN). The optimized process consists of a long-term step (4 min) at 600°C followed by a short-term step at 850°C for 1 min. A hole concentration of 1.40 × 1018 cm-3and a resistivity as low as 0.16 Ω-cm were achieved for the activated sample. The specific contact resistance for Ni/Au-contacted p-GaN and the turn-on voltage of GaN-based LEDs was determined to be 1.0 × 10 -4 Ω · cm2 and less than 3.2 V at 20 mA, which are improved results from those achieved by standard annealing process (750°C for 20 min).
源语言 | 英语 |
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主期刊名 | AD'07 - Proceedings of Asia Display 2007 |
页 | 1577-1581 |
页数 | 5 |
出版状态 | 已出版 - 2007 |
活动 | Asia Display 2007, AD'07 - Shanghai, 中国 期限: 12 3月 2007 → 16 3月 2007 |
出版系列
姓名 | AD'07 - Proceedings of Asia Display 2007 |
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卷 | 2 |
会议
会议 | Asia Display 2007, AD'07 |
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国家/地区 | 中国 |
市 | Shanghai |
时期 | 12/03/07 → 16/03/07 |
指纹
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Yu, Z., Gao, Y., & Seo, J. W. (2007). Activation of p-GaN in a two-step rapid thermal annealing process. 在 AD'07 - Proceedings of Asia Display 2007 (页码 1577-1581). (AD'07 - Proceedings of Asia Display 2007; 卷 2).