A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity

Tianfeng Zhou, Zhongyi Li, Weijia Guo*, Peng Liu, Bin Zhao, Xibin Wang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

1 引用 (Scopus)

摘要

Microlens arrays have been widely employed to control the reflection, refraction, and diffraction characteristics of light due to its distinctive surface properties. Precision glass molding (PGM) is the primary method for the mass production of microlens arrays, of which pressureless sintered silicon carbide (SSiC) is a typical mold material due to its excellent wear resistance, high thermal conductivity, high-temperature resistance, and low thermal expansion. However, the high hardness of SSiC makes it hard to be machined, especially for optical mold material that requires good surface quality. The lapping efficiency of SSiC molds is quite low. and the underlying mechanism remains insufficiently explored. In this study, an experimental study has been performed on SSiC. A spherical lapping tool and diamond abrasive slurry have been utilized and various parameters have been carried out to achieve fast material removal. The material removal characteristics and damage mechanism have been illustrated in detail. The findings reveal that the material removal mechanism involves a combination of ploughing, shearing, micro-cutting, and micro-fracturing, which aligns well with the results obtained from finite element method (FEM) simulations. This study serves as preliminary reference for the optimization of the precision machining of SSiC PGM molds with high efficiency and good surface quality.

源语言英语
文章编号1162
期刊Micromachines
14
6
DOI
出版状态已出版 - 6月 2023

指纹

探究 'A Study on the Material Removal Characteristics and Damage Mechanism of Lapping for Pressureless Sintered Silicon Carbide (SSiC) Microlens Cavity' 的科研主题。它们共同构成独一无二的指纹。

引用此