@inproceedings{7c9f398b9d0e4786b09c5d09d500330d,
title = "A Research on Stress Gradient for HIP in Ultrasonic Nondestructive Testing Technology",
abstract = "It is found in the inspection that bonding beryllium and copper together with two kinds of metals can lead to bad bonding, which seriously affects the safe operation of the equipment. In this paper, the residual stress distribution of the bonding block (beryllium side) at different depths is detected by using a probe of 15MHz, 10MHz, 7.5MHz, 5MHz, 4MHz. According to the propagation law of the critical refraction longitudinal wave and the ultrasonic detection system of the critical refraction longitudinal wave, the residual stress distribution of the bonding block (beryllium side) at different depths is detected. This shows that the critical refraction longitudinal wave with different frequencies can reflect the residual stress at different depths. By using this rule, the ultrasonic nondestructive evaluation of the stress gradient distribution along the depth of the surface of the bonding block can be made. The effect of stress gradient distribution on the bonding block is further investigated.",
keywords = "detection, metal bonding, residual stress, stress gradient, ultrasonic",
author = "Li, {Quan Wen} and Xu, {Chun Guang} and Li, {Zhi Xiang}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE Far East NDT New Technology and Application Forum, FENDT 2018 ; Conference date: 06-06-2018 Through 08-06-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/FENDT.2018.8681987",
language = "English",
series = "Proceedings of 2018 IEEE Far East NDT New Technology and Application Forum, FENDT 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "175--179",
editor = "Chunguang Xu",
booktitle = "Proceedings of 2018 IEEE Far East NDT New Technology and Application Forum, FENDT 2018",
address = "United States",
}