TY - JOUR
T1 - A novel experimental method for temperature measurement of high power diode laser
AU - Deng, Zeng
AU - Dai, Wei
AU - Shen, Jun
AU - Li, Ke
AU - Gong, Wenchi
AU - Yang, Zhiqiang
AU - Gong, Maoqiong
N1 - Publisher Copyright:
© 2018 International Heat Transfer Conference. All rights reserved.
PY - 2018
Y1 - 2018
N2 - Temperature is a significant parameter for evaluating the cooling efficiency of the electronic equipment. But it is difficult to measure with high accuracy when it comes to the high power diode lasers due to their small size and large temperature gradient. To handle this micro scale measurement issue, a novel experimental method was proposed based on similarity principle to enlarge the size of laser chips. Through analysis, ξ, Re and Pr are the most important dimensionless numbers which should be equal to each other if the laser chips and their heat sinks are enlarged without changing of the temperature field. By measuring the temperature of the enlarged simulated heat source, the chip's temperature can be obtained with high accuracy. Numerical simulations were done to validate the correctness of this method. The results show well correspondence in the small model and its 3 times larger model. The measurement uncertainty analysis shows that it can be an effective method for improving the temperature measuring accuracy of the laser chip.
AB - Temperature is a significant parameter for evaluating the cooling efficiency of the electronic equipment. But it is difficult to measure with high accuracy when it comes to the high power diode lasers due to their small size and large temperature gradient. To handle this micro scale measurement issue, a novel experimental method was proposed based on similarity principle to enlarge the size of laser chips. Through analysis, ξ, Re and Pr are the most important dimensionless numbers which should be equal to each other if the laser chips and their heat sinks are enlarged without changing of the temperature field. By measuring the temperature of the enlarged simulated heat source, the chip's temperature can be obtained with high accuracy. Numerical simulations were done to validate the correctness of this method. The results show well correspondence in the small model and its 3 times larger model. The measurement uncertainty analysis shows that it can be an effective method for improving the temperature measuring accuracy of the laser chip.
KW - Electronic equipment cooling
KW - Micro scale measurement
KW - Numerical simulation
KW - Similarity principle
UR - http://www.scopus.com/inward/record.url?scp=85068327196&partnerID=8YFLogxK
U2 - 10.1615/ihtc16.tpm.023906
DO - 10.1615/ihtc16.tpm.023906
M3 - Conference article
AN - SCOPUS:85068327196
SN - 2377-424X
VL - 2018-August
SP - 8911
EP - 8918
JO - International Heat Transfer Conference
JF - International Heat Transfer Conference
T2 - 16th International Heat Transfer Conference, IHTC 2018
Y2 - 10 August 2018 through 15 August 2018
ER -