TY - GEN
T1 - A Method for Model Thickness Analysis in Pro/E Environment
AU - Chai, Zhen
AU - Zhang, Xu
AU - Wang, Haoqi
AU - Zhang, Yuyou
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/1/4
Y1 - 2016/1/4
N2 - Wall thickness has a direct impact on the appearance, performance and cost of a part, wall thickness analysis is important (sometimes essential) to examine and improve the manufacturability of a part after the design is complete. The current method of wall thickness analysis in pro/Engineering environment is to establish equally spaced cross-sections in different directions, which is inefficient and can be error prone. This paper details a method to analysis wall thickness automatically, which includes format conversion (from prt to stl), octree decomposition and ray-tracing to obtain thickness values, color rendering according to thickness values, this method provides an overall intuitive display of the model and improves the thickness analysis efficiency.
AB - Wall thickness has a direct impact on the appearance, performance and cost of a part, wall thickness analysis is important (sometimes essential) to examine and improve the manufacturability of a part after the design is complete. The current method of wall thickness analysis in pro/Engineering environment is to establish equally spaced cross-sections in different directions, which is inefficient and can be error prone. This paper details a method to analysis wall thickness automatically, which includes format conversion (from prt to stl), octree decomposition and ray-tracing to obtain thickness values, color rendering according to thickness values, this method provides an overall intuitive display of the model and improves the thickness analysis efficiency.
KW - Pro/E
KW - octree decomposition
KW - ray-tracing
KW - thickness analysis
UR - http://www.scopus.com/inward/record.url?scp=84963525858&partnerID=8YFLogxK
U2 - 10.1109/CSMA.2015.77
DO - 10.1109/CSMA.2015.77
M3 - Conference contribution
AN - SCOPUS:84963525858
T3 - Proceedings - 2015 International Conference on Computer Science and Mechanical Automation, CSMA 2015
SP - 349
EP - 353
BT - Proceedings - 2015 International Conference on Computer Science and Mechanical Automation, CSMA 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Conference on Computer Science and Mechanical Automation, CSMA 2015
Y2 - 23 October 2015 through 25 October 2015
ER -