TY - GEN
T1 - A large range micro-XZ-stage with monolithic integration of electrothermal bimorph actuators and electrostatic comb drives
AU - Zhang, Xiaoyang
AU - Zhou, Liang
AU - Xie, Huikai
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/2/26
Y1 - 2016/2/26
N2 - This paper reports a micro-XZ-stage with large quasi-static displacement in both in-plane and out-of-plane directions, achieved by monolithic integration of large-vertical-displacement electrothermal Cu/W bimorph actuators and large-lateral-displacement electrostatic comb drives for the first time. The integration is enabled by a unique release process that can simultaneously attain high-aspect-ratio silicon comb drives and complete silicon removal underneath bimorph actuators. Over 40 μm in-plane displacement at 109.6 Vdc for the comb drives and 100 μm out-of-plane displacements at only 13.5 Vdc for the bimorph actuators have been realized for the fabricated device. The resonances of the out-of-plane bimorph actuators and the in-plane comb drives are 515 Hz and 477 Hz, respectively.
AB - This paper reports a micro-XZ-stage with large quasi-static displacement in both in-plane and out-of-plane directions, achieved by monolithic integration of large-vertical-displacement electrothermal Cu/W bimorph actuators and large-lateral-displacement electrostatic comb drives for the first time. The integration is enabled by a unique release process that can simultaneously attain high-aspect-ratio silicon comb drives and complete silicon removal underneath bimorph actuators. Over 40 μm in-plane displacement at 109.6 Vdc for the comb drives and 100 μm out-of-plane displacements at only 13.5 Vdc for the bimorph actuators have been realized for the fabricated device. The resonances of the out-of-plane bimorph actuators and the in-plane comb drives are 515 Hz and 477 Hz, respectively.
UR - http://www.scopus.com/inward/record.url?scp=84970974365&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2016.7421560
DO - 10.1109/MEMSYS.2016.7421560
M3 - Conference contribution
AN - SCOPUS:84970974365
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 71
EP - 74
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -