A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes

Zewen Wei; Huang Huang; Zicai Liang; Zhihong Li

doi:10.1109/MEMSYS.2010.5442365

A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes

Zewen Wei^*, Huang Huang, Zicai Liang, Zhihong Li

^*此作品的通讯作者

Peking University

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

2 引用（Scopus）

摘要

Electroporation, in which electric pulses are applied to create transient pores in the cell membrane, is widely used to introduce biologically active molecules into cells. Here we report a novel electroporation chip with great performance and good compatibility with the standard multi-well plate used in biological research. We demonstrated a prototype chip integrating with a 12-well plate and successfully electroporated both adherent and supernatant cells. Using the standard expression cell line HEK-293 and expression vector pEGFP-C3, we realized excellent cell viability (80%) and transfection rate (90%), both much higher than those in previously reported methods.

源语言	英语
主期刊名	MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
页	951-954
页数	4
DOI	https://doi.org/10.1109/MEMSYS.2010.5442365
出版状态	已出版 - 2010
已对外发布	是
活动	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, 中国期限: 24 1月 2010 → 28 1月 2010

出版系列

姓名	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN（印刷版）	1084-6999

会议

会议	23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
国家/地区	中国
市	Hong Kong
时期	24/01/10 → 28/01/10

访问文件

10.1109/MEMSYS.2010.5442365

其它文件与链接

链接到 Scopus 的出版物

引用此

Wei, Z., Huang, H., Liang, Z., & Li, Z. (2010). A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes. 在 MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest (页码 951-954). 文章 5442365 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2010.5442365

Wei, Zewen ; Huang, Huang ; Liang, Zicai 等. / A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes. MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. 页码 951-954 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{7b910fcafc4e436bac84310afa00fa11,

title = "A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes",

abstract = "Electroporation, in which electric pulses are applied to create transient pores in the cell membrane, is widely used to introduce biologically active molecules into cells. Here we report a novel electroporation chip with great performance and good compatibility with the standard multi-well plate used in biological research. We demonstrated a prototype chip integrating with a 12-well plate and successfully electroporated both adherent and supernatant cells. Using the standard expression cell line HEK-293 and expression vector pEGFP-C3, we realized excellent cell viability (80%) and transfection rate (90%), both much higher than those in previously reported methods.",

author = "Zewen Wei and Huang Huang and Zicai Liang and Zhihong Li",

year = "2010",

doi = "10.1109/MEMSYS.2010.5442365",

language = "English",

isbn = "9781424457649",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "951--954",

booktitle = "MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest",

note = "23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 ; Conference date: 24-01-2010 Through 28-01-2010",

}

Wei, Z, Huang, H, Liang, Z & Li, Z 2010, A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes. 在 MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest., 5442365, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 页码 951-954, 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010, Hong Kong, 中国, 24/01/10. https://doi.org/10.1109/MEMSYS.2010.5442365

A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes. / Wei, Zewen; Huang, Huang; Liang, Zicai 等.
MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. 页码 951-954 5442365 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes

AU - Wei, Zewen

AU - Huang, Huang

AU - Liang, Zicai

AU - Li, Zhihong

PY - 2010

Y1 - 2010

N2 - Electroporation, in which electric pulses are applied to create transient pores in the cell membrane, is widely used to introduce biologically active molecules into cells. Here we report a novel electroporation chip with great performance and good compatibility with the standard multi-well plate used in biological research. We demonstrated a prototype chip integrating with a 12-well plate and successfully electroporated both adherent and supernatant cells. Using the standard expression cell line HEK-293 and expression vector pEGFP-C3, we realized excellent cell viability (80%) and transfection rate (90%), both much higher than those in previously reported methods.

AB - Electroporation, in which electric pulses are applied to create transient pores in the cell membrane, is widely used to introduce biologically active molecules into cells. Here we report a novel electroporation chip with great performance and good compatibility with the standard multi-well plate used in biological research. We demonstrated a prototype chip integrating with a 12-well plate and successfully electroporated both adherent and supernatant cells. Using the standard expression cell line HEK-293 and expression vector pEGFP-C3, we realized excellent cell viability (80%) and transfection rate (90%), both much higher than those in previously reported methods.

UR - http://www.scopus.com/inward/record.url?scp=77952772389&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2010.5442365

DO - 10.1109/MEMSYS.2010.5442365

M3 - Conference contribution

AN - SCOPUS:77952772389

SN - 9781424457649

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 951

EP - 954

BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest

T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010

Y2 - 24 January 2010 through 28 January 2010

ER -

Wei Z, Huang H, Liang Z, Li Z. A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes. 在 MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest. 2010. 页码 951-954. 5442365. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2010.5442365

A high performance electroporation chip integrating multi-well plate and annular interdigital microelectrodes

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