A calculation method for the coupling of temperature and concentration during inconel 718 alloy solidification

Ao Xiaohui, Xia Huanxiong*, Liu Jianhua, He Qiyang, Lin Shengxiang

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Due to the temperature and concentration determine the kinetic undercooling of interface growth and nucleation undercooling inside the melt, they play an important role in the solidification microstructure of the alloy. In this paper, the effect of temperature gradient and cooling rate on the dynamic undercooling was studied and the mechanism of the concentration at the solid-liquid interface on the kinetic undercooling during the continuous cooling process was analyzed. A calculation method for the coupling of temperature and concentration during Inconel 718 alloy solidification was developed, which can solve the problem that the concentration and temperature are difficult to be calculated at the same time in the numerical calculation.

源语言英语
主期刊名Metallurgy Technology and Materials VIII - Selected peer-reviewed full text papers from the 8th International Conference on Metallurgy Technology and Materials, ICMTM 2020
编辑Nor Sabirin Mohamed
出版商Trans Tech Publications Ltd.
50-55
页数6
ISBN(印刷版)9783035737004
DOI
出版状态已出版 - 2021
活动8th International Conference on Metallurgy Technology and Materials, ICMTM 2020 - Xian, 中国
期限: 1 8月 20202 8月 2020

出版系列

姓名Solid State Phenomena
315 SSP
ISSN(印刷版)1012-0394
ISSN(电子版)1662-9779

会议

会议8th International Conference on Metallurgy Technology and Materials, ICMTM 2020
国家/地区中国
Xian
时期1/08/202/08/20

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引用此

Xiaohui, A., Huanxiong, X., Jianhua, L., Qiyang, H., & Shengxiang, L. (2021). A calculation method for the coupling of temperature and concentration during inconel 718 alloy solidification. 在 N. S. Mohamed (编辑), Metallurgy Technology and Materials VIII - Selected peer-reviewed full text papers from the 8th International Conference on Metallurgy Technology and Materials, ICMTM 2020 (页码 50-55). (Solid State Phenomena; 卷 315 SSP). Trans Tech Publications Ltd.. https://doi.org/10.4028/www.scientific.net/SSP.315.50