A Broadband 195-245GHz AMC Embedded On-chip Antenna Based on InP Substrate

Xinyue Wang, Yao Li, Gang Gao, Weihua Yu*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

This paper proposes an attractive terahertz on-chip antenna based on indium phosphide (InP) substrate, which could be integrated with the millimeter-wave/terahertz radio frequency module. The embedded cross-shaped artificial magnetic conductor (AMC) array fed by the coplanar substrate integrated wave-guide (SIW) with a symmetrical slot improves radiation efficiency over the operating band, and the folded monopole radiation patch is fabricated by the top layer to isolate the signal crosstalk. Benefiting from high electron mobility and the multi-layer metal process of InP, it offers flexibility in THz on-chip antenna fabrication, and a good compromise is achieved in terms of gain, bandwidth, radiation efficiency, transmission lossy, size, and so on. According to the simulated results, the proposed architecture gets more than 70% in radiation efficiency, a 40% increase in peak efficiency compared to the AMC-free one, while operating at 195 to 245GHz at the cost area of 0.6× 0.6mm2. At the same time, it presents a maximum gain of 5dBi at 220GHz, which is suitable for next-generation communication applications.

源语言英语
主期刊名2022 IEEE 10th Asia-Pacific Conference on Antennas and Propagation, APCAP 2022 - Proceedings
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781665489546
DOI
出版状态已出版 - 2022
活动10th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2022 - Xiamen, 中国
期限: 4 11月 20227 11月 2022

出版系列

姓名2022 IEEE 10th Asia-Pacific Conference on Antennas and Propagation, APCAP 2022 - Proceedings

会议

会议10th IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2022
国家/地区中国
Xiamen
时期4/11/227/11/22

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