TY - JOUR
T1 - 高温数字图像相关方法中的制斑和图像处理技术
AU - Duan, Qiyuan
AU - Gong, Wenran
AU - Guo, Baoqiao
AU - Wu, Lifu
AU - Yu, Xingzhe
AU - Xie, Huimin
N1 - Publisher Copyright:
© 2019, Tsinghua University Press. All right reserved.
PY - 2019/6/1
Y1 - 2019/6/1
N2 - According to requirement of the high-temperature application from the digital image correlation (DIC) method, the speckle fabrication methods and high-temperature speckle image processing technique are studied in this paper. Taking high-temperature structural materials as the studied objects, a high-temperature speckle fabrication technique based on parametric template is developed. The technique is mainly based on a parametric template, which can adjust the parameters such as particle size, distribution density, and randomness in the template. As a result, the quality of the speckle can be optimized. A high-temperature speckle pattern was successful fabricated on the C-SiC composite substrate by the proposed technique, and the experiment verifies the speckle carrier can endure high temperature up to 1 200℃. At the same time, the influence factors of thermal disturbance and thermal radiation on DIC measurement results are analyzed. The high-temperature speckle images are corrected with approaches of image grayscale-average, circulating thermal disturbance and optical filtering method. And a test for measuring the thermal expansion coefficient is designed to verify the feasibility of the correction methods.
AB - According to requirement of the high-temperature application from the digital image correlation (DIC) method, the speckle fabrication methods and high-temperature speckle image processing technique are studied in this paper. Taking high-temperature structural materials as the studied objects, a high-temperature speckle fabrication technique based on parametric template is developed. The technique is mainly based on a parametric template, which can adjust the parameters such as particle size, distribution density, and randomness in the template. As a result, the quality of the speckle can be optimized. A high-temperature speckle pattern was successful fabricated on the C-SiC composite substrate by the proposed technique, and the experiment verifies the speckle carrier can endure high temperature up to 1 200℃. At the same time, the influence factors of thermal disturbance and thermal radiation on DIC measurement results are analyzed. The high-temperature speckle images are corrected with approaches of image grayscale-average, circulating thermal disturbance and optical filtering method. And a test for measuring the thermal expansion coefficient is designed to verify the feasibility of the correction methods.
KW - Digital image correlation
KW - High temperature
KW - Thermal disturbance
KW - Thermal radiation, speckle pattern
UR - http://www.scopus.com/inward/record.url?scp=85071136422&partnerID=8YFLogxK
U2 - 10.16511/j.cnki.qhdxxb.2019.26.006
DO - 10.16511/j.cnki.qhdxxb.2019.26.006
M3 - 文章
AN - SCOPUS:85071136422
SN - 1000-0054
VL - 59
SP - 425
EP - 431
JO - Qinghua Daxue Xuebao/Journal of Tsinghua University
JF - Qinghua Daxue Xuebao/Journal of Tsinghua University
IS - 6
ER -