金属纳米线的制备及其在电子材料中的应用

Qing Liu, Xiaofeng Dai, Teng Zhang, Hongbin Shi, Yabing Zhang, Tao Wang*

*此作品的通讯作者

科研成果: 期刊稿件文献综述同行评审

4 引用 (Scopus)

摘要

As the development of integration and flexibility of electronic devices, the traditional tin-lead solders, indium tin oxide (ITO) films and other materials no longer meet the requirements of properties, such as electric conductivity, thermal conductivity and flexibility. Metallic nanowires have excellent photoelectric properties and unique one-dimensional structure. New materials with them as key components have become the most potential substitutes for traditional electronic materials. The commercialization of metallic nanowires involves the aspects of raw material, equipment, process and application. However, the key technique lies in the large-scale, low-cost, green and efficient preparation of metallic nanowires. In this paper, the preparation methods of metallic nanowires are reviewed, including physical vapor deposition, chemical vapor deposition, template assisted, solvothermal process and polyol method. The applications of metallic nanowires in the field of electronic materials, such as conductive adhesives, transparent conductive films and thermal interface materials are summarized.

投稿的翻译标题Preparation and applications in electronic materials of metallic nanowires
源语言繁体中文
页(从-至)681-708
页数28
期刊Huagong Xuebao/CIESC Journal
72
2
DOI
出版状态已出版 - 2月 2021
已对外发布

关键词

  • Conductive adhesives
  • Electronic materials
  • Metallic nanowires
  • Nano materials
  • Preparation
  • Thermal interface materials
  • Transparent conductive films

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