摘要
Interdisciplinary innovation is a prominent feature of knowledge intensive industries. A thorough understanding of the interdisciplinary innovation mechanism is an important issue to solve the ‘bottleneck’ problem of knowledge intensive technologies and accelerate the self - reliance of high - level science and technology. This study focuses on chip manufacturing, a typical knowledge - intensive industry. Based on 42785 chip manufacturing patent data from 2000 to 2020, it empirically explores the impact mechanism of multi - disciplinary intersection on technological innovation in knowledge - intensive industries. The results show that: (1) there is a significant inverse " U" relationship between the balance of the discipline system and the value of technological innovation, that is, " innovation comes from the edge of chaos" . Compared with the " no center" and " absolute center" disciplinary interaction models, the " dominant auxiliary" disciplinary interaction model is more conducive to the promotion of technological innovation value. (2) The difference of subject content has a positive role in promoting the value of technological innovation. (3) There is an inverse " U" relationship between the diversity of disciplines and the value of technological innovation. The research conclusions provide important theoretical and practical implications for dialectically promoting interdisciplinary innovation, accelerating breakthroughs in key core technologies in knowledge intensive industries, enhancing the safety and resilience of the industrial chain supply chain, and effectively supporting high level self - reliance of science and technology.
投稿的翻译标题 | Research on multidisciplinary innovation mechanism of knowledge intensive industry |
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源语言 | 繁体中文 |
页(从-至) | 415-426 |
页数 | 12 |
期刊 | Studies in Science of Science |
卷 | 42 |
期 | 2 |
出版状态 | 已出版 - 15 2月 2024 |
关键词
- chip
- differences of subject content
- discipline system balance
- diversity of disciplines
- improvement
- knowledge intensive industries
- reliance and self
- S&T self