TY - JOUR
T1 - 压接型 IGBT 器件短路失效管壳爆炸特性及防护方法
AU - Zhou, Yang
AU - Tang, Xinling
AU - Wang, Liang
AU - Zhang, Xiaowei
AU - Dai, Anqi
AU - Lin, Zhongkang
AU - Jin, Rui
AU - Wei, Xiaoguang
N1 - Publisher Copyright:
© 2024 Chinese Society for Electrical Engineering. All rights reserved.
PY - 2024/3/20
Y1 - 2024/3/20
N2 - Nowadays, press pack insulated gate bipolar transistors (IGBTs) are the core parts of the existing flexible HVDC equipment. In practical applications, owing to high-voltage and large-current working environment, press pack IGBT devices are prone to short-circuited passing effects, which is likely to give rise to structural explosion. In order to research the damage effect of this explosion and its protection, this paper carries out multiple groups of modular multilevel converter (MMC) working experiments, and obtains the deformation characteristics of the structure of the IGBT device short-circuit loss after the explosion of the explosion. Combined with the characteristics of the actual explosion failure, the equivalent TNT explosion equivalent in the actual explosion is initially determined. On this basis, the structural optimization design of IGBT devices is carried out from the perspective of improving the structural anti-explosion capacity, increasing energy leakage channels, and replacing structural materials. Based on the analysis of the failure characteristics of the IGBT device structure and electrical energy characteristics, the numerical simulation model of the IGBT device structure is established, the response characteristics of the explosion structure of the device under different TNT volume and explosive position conditions are analyzed, and then relevant test verification is carried out. The result shows that replacing the ceramic material of the shell to fiber enhanced composite materials can effectively improve the explosion-resistant performance of the structure and reduce the destruction of the device.
AB - Nowadays, press pack insulated gate bipolar transistors (IGBTs) are the core parts of the existing flexible HVDC equipment. In practical applications, owing to high-voltage and large-current working environment, press pack IGBT devices are prone to short-circuited passing effects, which is likely to give rise to structural explosion. In order to research the damage effect of this explosion and its protection, this paper carries out multiple groups of modular multilevel converter (MMC) working experiments, and obtains the deformation characteristics of the structure of the IGBT device short-circuit loss after the explosion of the explosion. Combined with the characteristics of the actual explosion failure, the equivalent TNT explosion equivalent in the actual explosion is initially determined. On this basis, the structural optimization design of IGBT devices is carried out from the perspective of improving the structural anti-explosion capacity, increasing energy leakage channels, and replacing structural materials. Based on the analysis of the failure characteristics of the IGBT device structure and electrical energy characteristics, the numerical simulation model of the IGBT device structure is established, the response characteristics of the explosion structure of the device under different TNT volume and explosive position conditions are analyzed, and then relevant test verification is carried out. The result shows that replacing the ceramic material of the shell to fiber enhanced composite materials can effectively improve the explosion-resistant performance of the structure and reduce the destruction of the device.
KW - explosion characteristics
KW - explosion-proof
KW - press pack insulated gate bipolar transistor (IGBT)
KW - short circuit failure
KW - simulation
UR - http://www.scopus.com/inward/record.url?scp=85188862633&partnerID=8YFLogxK
U2 - 10.13334/j.0258-8013.pcsee.222464
DO - 10.13334/j.0258-8013.pcsee.222464
M3 - 文章
AN - SCOPUS:85188862633
SN - 0258-8013
VL - 44
SP - 2350
EP - 2361
JO - Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering
JF - Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering
IS - 6
ER -