XPS analysis of silicon oxycarbide formed on the surface of Rf-sputter deposited SiC thin films

Kun Xue*, Li Sha Niu, Hui Ji Shi, Jiwen Liu

*Corresponding author for this work

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Abstract

Sputter deposited SiC films with and without annealing were characterized using X-ray photoelectron spectroscopy (XPS). A complex transition layer, containing silicon oxycarbide (SiCxOy), between the SiO2 layer grown during extended exposure to ambient air or annealing and SiC substrate was investigated. Furthermore, the presence of excessive amorphous carbon was detected in the near-surface region for annealed sample. We justified the differences of composition and chemical bonding in these two oxide layers in terms of different oxidation kinetics involved.

Original languageEnglish
Pages (from-to)1871-1874
Number of pages4
JournalKey Engineering Materials
Volume353-358
Issue numberPART 3
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventAsian Pacific Conference for Fracture and Strength (APCFS'06) - Sanya, Hainan Island, China
Duration: 22 Nov 200625 Nov 2006

Keywords

  • Air-exposure
  • Annealing
  • Oxide/SiC interface
  • SiC thin films
  • XPS

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Xue, K., Niu, L. S., Shi, H. J., & Liu, J. (2007). XPS analysis of silicon oxycarbide formed on the surface of Rf-sputter deposited SiC thin films. Key Engineering Materials, 353-358(PART 3), 1871-1874. https://doi.org/10.4028/0-87849-456-1.1871