W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining

Jianwen Liang; Yijing He; Wenhao Tan; Hao Luo; Houjun Sun

doi:10.1109/IWS55252.2022.9977474

W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining

Jianwen Liang, Yijing He^*, Wenhao Tan, Hao Luo, Houjun Sun

^*Corresponding author for this work

School of Integrated Circuits and Electronics

Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, a multilayer W-band 8 times 8 slot array antenna processed using hybrid technology of silicon micromachining and metal machining is presented. The proposed antenna is composed of four silicon layers for radiating part and two metal layers for feeding network. Adjacent gold-plated silicon substrates and the metal cover plate are connected by gold-gold bonding. Using bulk silicon processing, high fabrication accuracy is realized for the 94-GHz large-scale array antenna. Metal-machining gap waveguide with artificial magnetic conductor (AMC) structure is elaborated for the corporate feeding network. Each 2 times 2-elements slots subarray is excited by the TM240-mode cavity element below. Besides, a structural transition from standard waveguide WR-10 to gap waveguide is employed. Simulated results indicate that the proposed antenna can achieve 6.4 % ( vert mathrm{S}11 vert < -10 text{dB}) operating bandwidth covering from 91.2 to 97.27 GHz, with the gain greater than 26.1 dBi. The proposed antenna has the merits of high gain, heterogeneous integration and low cost, promising usage in various millimeter-wave wireless systems.

Original language	English
Title of host publication	2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665481977
DOIs	https://doi.org/10.1109/IWS55252.2022.9977474
Publication status	Published - 2022
Event	9th IEEE MTT-S International Wireless Symposium, IWS 2022 - Harbin, China Duration: 12 Aug 2022 → 15 Aug 2022

Publication series

Name	2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings

Conference

Conference	9th IEEE MTT-S International Wireless Symposium, IWS 2022
Country/Territory	China
City	Harbin
Period	12/08/22 → 15/08/22

Keywords

Slot array antenna
gap waveguide
gold-gold bonding
millimeter wave
silicon micro machining technology

Access to Document

10.1109/IWS55252.2022.9977474

Cite this

Liang, J., He, Y., Tan, W., Luo, H., & Sun, H. (2022). W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining. In 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings (2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IWS55252.2022.9977474

Liang, Jianwen ; He, Yijing ; Tan, Wenhao et al. / W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining. 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings).

@inproceedings{c8e5c97d973e4d819be7da6a1f393aaf,

title = "W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining",

abstract = "In this paper, a multilayer W-band 8 times 8 slot array antenna processed using hybrid technology of silicon micromachining and metal machining is presented. The proposed antenna is composed of four silicon layers for radiating part and two metal layers for feeding network. Adjacent gold-plated silicon substrates and the metal cover plate are connected by gold-gold bonding. Using bulk silicon processing, high fabrication accuracy is realized for the 94-GHz large-scale array antenna. Metal-machining gap waveguide with artificial magnetic conductor (AMC) structure is elaborated for the corporate feeding network. Each 2 times 2-elements slots subarray is excited by the TM240-mode cavity element below. Besides, a structural transition from standard waveguide WR-10 to gap waveguide is employed. Simulated results indicate that the proposed antenna can achieve 6.4 % ( vert mathrm{S}11 vert < -10 text{dB}) operating bandwidth covering from 91.2 to 97.27 GHz, with the gain greater than 26.1 dBi. The proposed antenna has the merits of high gain, heterogeneous integration and low cost, promising usage in various millimeter-wave wireless systems.",

keywords = "Slot array antenna, gap waveguide, gold-gold bonding, millimeter wave, silicon micro machining technology",

author = "Jianwen Liang and Yijing He and Wenhao Tan and Hao Luo and Houjun Sun",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 9th IEEE MTT-S International Wireless Symposium, IWS 2022 ; Conference date: 12-08-2022 Through 15-08-2022",

year = "2022",

doi = "10.1109/IWS55252.2022.9977474",

language = "English",

series = "2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings",

address = "United States",

}

Liang, J, He, Y, Tan, W, Luo, H & Sun, H 2022, W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining. in 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings. 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 9th IEEE MTT-S International Wireless Symposium, IWS 2022, Harbin, China, 12/08/22. https://doi.org/10.1109/IWS55252.2022.9977474

W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining. / Liang, Jianwen; He, Yijing; Tan, Wenhao et al.
2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining

AU - Liang, Jianwen

AU - He, Yijing

AU - Tan, Wenhao

AU - Luo, Hao

AU - Sun, Houjun

PY - 2022

Y1 - 2022

N2 - In this paper, a multilayer W-band 8 times 8 slot array antenna processed using hybrid technology of silicon micromachining and metal machining is presented. The proposed antenna is composed of four silicon layers for radiating part and two metal layers for feeding network. Adjacent gold-plated silicon substrates and the metal cover plate are connected by gold-gold bonding. Using bulk silicon processing, high fabrication accuracy is realized for the 94-GHz large-scale array antenna. Metal-machining gap waveguide with artificial magnetic conductor (AMC) structure is elaborated for the corporate feeding network. Each 2 times 2-elements slots subarray is excited by the TM240-mode cavity element below. Besides, a structural transition from standard waveguide WR-10 to gap waveguide is employed. Simulated results indicate that the proposed antenna can achieve 6.4 % ( vert mathrm{S}11 vert < -10 text{dB}) operating bandwidth covering from 91.2 to 97.27 GHz, with the gain greater than 26.1 dBi. The proposed antenna has the merits of high gain, heterogeneous integration and low cost, promising usage in various millimeter-wave wireless systems.

AB - In this paper, a multilayer W-band 8 times 8 slot array antenna processed using hybrid technology of silicon micromachining and metal machining is presented. The proposed antenna is composed of four silicon layers for radiating part and two metal layers for feeding network. Adjacent gold-plated silicon substrates and the metal cover plate are connected by gold-gold bonding. Using bulk silicon processing, high fabrication accuracy is realized for the 94-GHz large-scale array antenna. Metal-machining gap waveguide with artificial magnetic conductor (AMC) structure is elaborated for the corporate feeding network. Each 2 times 2-elements slots subarray is excited by the TM240-mode cavity element below. Besides, a structural transition from standard waveguide WR-10 to gap waveguide is employed. Simulated results indicate that the proposed antenna can achieve 6.4 % ( vert mathrm{S}11 vert < -10 text{dB}) operating bandwidth covering from 91.2 to 97.27 GHz, with the gain greater than 26.1 dBi. The proposed antenna has the merits of high gain, heterogeneous integration and low cost, promising usage in various millimeter-wave wireless systems.

KW - Slot array antenna

KW - gap waveguide

KW - gold-gold bonding

KW - millimeter wave

KW - silicon micro machining technology

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U2 - 10.1109/IWS55252.2022.9977474

DO - 10.1109/IWS55252.2022.9977474

M3 - Conference contribution

AN - SCOPUS:85146232949

T3 - 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings

BT - 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 9th IEEE MTT-S International Wireless Symposium, IWS 2022

Y2 - 12 August 2022 through 15 August 2022

ER -

Liang J, He Y, Tan W, Luo H, Sun H. W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining. In 2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. (2022 IEEE MTT-S International Wireless Symposium, IWS 2022 - Proceedings). doi: 10.1109/IWS55252.2022.9977474

W-Band 8 × 8 Slot Array Antenna Using Hybrid Processing Technology of Silicon Micromachining and Metal Machining

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Keywords

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