@inproceedings{a1bf28b1a2fe4d1e8eae008c4986fc2b,
title = "Ultrasonic microscopy method for coating and interface bonding quality detection",
abstract = "This paper describes methods for non-destructive testing of the bonding quality of coatings and interfaces by an ultrasonic microscopy system. Based on previous studies, the reflection and transmission echoes of ultrasonic waves at the coating/matrix and other forms of multi-layer interfaces were analyzed, and the relationship between the echo signals and bonding quality of the interfaces was derived. The ultrasonic microscopy was used for non-destructive testing. In experiments, coating specimens, a titanium alloy superconducting device and the laminated Silicon wafers were tested and bonding qualities of which were obtained.",
keywords = "bonding quality, coating, interface, ultrasonic",
author = "Wang, {Qiu Tao} and Xu, {Chun Guang} and Chao Yang and Zhu, {Yan Ling} and Lei He",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE Far East NDT New Technology and Application Forum, FENDT 2019 ; Conference date: 24-06-2019 Through 27-06-2019",
year = "2019",
month = jun,
doi = "10.1109/FENDT47723.2019.8962664",
language = "English",
series = "Proceedings of 2019 IEEE Far East NDT New Technology and Application Forum, FENDT 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "96--99",
editor = "Chunguang Xu",
booktitle = "Proceedings of 2019 IEEE Far East NDT New Technology and Application Forum, FENDT 2019",
address = "United States",
}