TY - GEN
T1 - Ultra-Compact Wideband Microdisk SI-GE Avalanche Photodetector
AU - Jiang, Yushu
AU - Wang, Xiajunru
AU - Zhou, Lang
AU - Zhang, Qianlong
AU - Wang, Bin
AU - Zhang, Weifeng
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - We design and fabricate an ultra-compact wideband Si-Ge avalanche photodetector (APD) based on a microdisk resonator incorporated with a lateral PN junction. The device has a radius as small as 3.70 μm and it is fabricated using a standard foundry multi-project wafer (MPW) run, which facilitates cost-effective volume fabrication. The fabricated APD exhibits a low breakdown voltage of -5.66 V, leading to low power consumption in avalanche mode. At a bias voltage of -5.75 V, slightly lower than the breakdown voltage, the APD achieves a high responsivity of 8.50 A/W at -30 dBm input power and a wide bandwidth of 19.20 GHz. The proposed APD holds key advantages of ultra-compact footprint, low operating voltage, high responsivity, and wide bandwidth, making it promising for large-scale optical interconnection networks and microwave photonic systems.
AB - We design and fabricate an ultra-compact wideband Si-Ge avalanche photodetector (APD) based on a microdisk resonator incorporated with a lateral PN junction. The device has a radius as small as 3.70 μm and it is fabricated using a standard foundry multi-project wafer (MPW) run, which facilitates cost-effective volume fabrication. The fabricated APD exhibits a low breakdown voltage of -5.66 V, leading to low power consumption in avalanche mode. At a bias voltage of -5.75 V, slightly lower than the breakdown voltage, the APD achieves a high responsivity of 8.50 A/W at -30 dBm input power and a wide bandwidth of 19.20 GHz. The proposed APD holds key advantages of ultra-compact footprint, low operating voltage, high responsivity, and wide bandwidth, making it promising for large-scale optical interconnection networks and microwave photonic systems.
KW - Avalanche photodetector
KW - lateral PN junction
KW - microdisk resonator
UR - http://www.scopus.com/inward/record.url?scp=85210858528&partnerID=8YFLogxK
U2 - 10.1109/MWP62612.2024.10736300
DO - 10.1109/MWP62612.2024.10736300
M3 - Conference contribution
AN - SCOPUS:85210858528
T3 - 2024 International Topical Meeting on Microwave Photonics, MWP 2024
BT - 2024 International Topical Meeting on Microwave Photonics, MWP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 International Topical Meeting on Microwave Photonics, MWP 2024
Y2 - 17 September 2024 through 20 September 2024
ER -