Two-dimensional ultrasonically assisted grinding of monocrystal silicon

Two-dimensional ultrasonically assisted grinding technique is proposed for the machining of monocrystal silicon in order to achieve high material removal rate and high surface quality simultaneously. In this technique, the workpiece is attached on the ultrasonic vibrator produced by bonding a PZT device on a metal elastic body, and the elliptic vibration is generated by the simultaneous creation of the longitudinal and bending vibration of the vibrator. The grinding experiments are carried out and experimental results show that the grinding forces decrease enormously; the surface quality is improved; the dimensions of grinding grooves are significantly smaller; the chip is thicker and shorter compared with those in the conventional grinding.