Abstract
A triaxial high-g accelerometer of microelectro mechanical systems(MEMS) has a structure of multi-chips combination and will be used in aerospace field, civil and military fields. The accelerometer can measure the acceleration of the carrier. The chips with island-membrane structures on its back surfaces are made by MEMS dry processing. The chip is reasonable and can work well under high impact load; Titanium alloy base is also stronger in high shock environment, these are proved by finite element analysis. Finally, the MEMS combined triaxial high-g accelerometer is validated by high impact calibration experiments in order to get a key performance index, including range, sensitivity and transverse sensitivity and so on. These data can satisfy the need of design but some problems remain, these will be eliminated by improvement of the processing technology and materials.
Original language | English |
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Pages (from-to) | 427-431 |
Number of pages | 5 |
Journal | Journal of Beijing Institute of Technology (English Edition) |
Volume | 24 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1 Dec 2015 |
Keywords
- Accelerometer
- Combined
- Finite element analysis
- High-g
- Triaxial