Thermal conductivity of polyamide 12 powder for use in laser sintering

Purpose - The purpose of this paper is to acquire thermal conductivities of both fresh and preheated polyamide 12 powder under various conditions to provide a basis for effective and accurate control during the laser sintering (LS) process. Design/methodology/approach - A Hot Disk® TPS 500 thermal measurement system using a transient plane source (TPS) technology was employed for thermal conductivity measurements. Polyamide 12 powder was packed at different densities, and different carrier gases were used. Tests were also performed on fully dense laser sintered polyamide 12 to establish a baseline. Findings - Polyamide 12 powder thermal conductivity varies with packing density and temperature, which is approximately one-third bulk form thermal conductivity. Inter-particle bonding is the primary factor influencing polyamide 12 thermal conductivity. Research limitations/implications - Limited ranges of density were tested, and the carrier gas needed carefully control to prevent powder oxidation. Thermal properties obtained were not tested in the LS process. Originality/value - This experimental result could be used to enhance thermal control during the LS process.