The study of the RF field in a plasma reactor

Wu Ren*, Benqing Gao, Zhenghui Xue, Weiming Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

Capacitively coupled plasma reactors are commonly used for plasma enhanced deposition or dry etching in semiconductor applications. The rf field driven at one single-frequency source in the plasma reactor is very important for the quality of finished semiconductor products, so how to generate an uniform rf field distribution is the key technology in applications. This paper discusses two techniques to improve the uniform characteristics of rf field, one is using more rf excitation sources and the other is using shaped rf electrodes. The paper also gives some simulation results analyzed by FDTD method, which proves the effectiveness of the technology.

Original languageEnglish
Title of host publicationCSQRWC 2012 - 2012 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference
Pages191-194
Number of pages4
DOIs
Publication statusPublished - 2012
Event2012 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference, CSQRWC 2012 - New Taipei City, Banqiao Dist., Taiwan, Province of China
Duration: 23 Jul 201227 Jul 2012

Publication series

NameCSQRWC 2012 - 2012 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference

Conference

Conference2012 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference, CSQRWC 2012
Country/TerritoryTaiwan, Province of China
CityNew Taipei City, Banqiao Dist.
Period23/07/1227/07/12

Keywords

  • FDTD
  • Plasma
  • reactor
  • rf source
  • shaped rf electrodes

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