The packaging effect on high g accelerometer test

Yunbo Shi; Zhengqiang Zhu; Ping Li; Jun Liu

doi:10.1109/NEMS.2010.5592255

The packaging effect on high g accelerometer test

Yunbo Shi^*, Zhengqiang Zhu, Ping Li, Jun Liu

^*Corresponding author for this work

National Key Laboratory of Science and Technology on Electronic Test and Measurement

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.

Original language	English
Title of host publication	2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Pages	720-722
Number of pages	3
DOIs	https://doi.org/10.1109/NEMS.2010.5592255
Publication status	Published - 2010
Externally published	Yes
Event	5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China Duration: 20 Jan 2010 → 23 Jan 2010

Publication series

Name	2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Conference

Conference	5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Country/Territory	China
City	Xiamen
Period	20/01/10 → 23/01/10

Keywords

High g acceleration sensor
Modal frequency
Sensor packaging

Access to Document

10.1109/NEMS.2010.5592255

Cite this

@inproceedings{03bef0a25ab142dbbe1cee75aabade76,

title = "The packaging effect on high g accelerometer test",

abstract = "To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.",

keywords = "High g acceleration sensor, Modal frequency, Sensor packaging",

author = "Yunbo Shi and Zhengqiang Zhu and Ping Li and Jun Liu",

year = "2010",

doi = "10.1109/NEMS.2010.5592255",

language = "English",

isbn = "9781424465439",

series = "2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010",

pages = "720--722",

booktitle = "2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010",

note = "5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 ; Conference date: 20-01-2010 Through 23-01-2010",

}

Shi, Y, Zhu, Z, Li, P & Liu, J 2010, The packaging effect on high g accelerometer test. in 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010., 5592255, 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, pp. 720-722, 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010, Xiamen, China, 20/01/10. https://doi.org/10.1109/NEMS.2010.5592255

The packaging effect on high g accelerometer test. / Shi, Yunbo; Zhu, Zhengqiang; Li, Ping et al.
2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010. 2010. p. 720-722 5592255 (2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - The packaging effect on high g accelerometer test

AU - Shi, Yunbo

AU - Zhu, Zhengqiang

AU - Li, Ping

AU - Liu, Jun

PY - 2010

Y1 - 2010

N2 - To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.

AB - To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.

KW - High g acceleration sensor

KW - Modal frequency

KW - Sensor packaging

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DO - 10.1109/NEMS.2010.5592255

M3 - Conference contribution

AN - SCOPUS:78649277236

SN - 9781424465439

T3 - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

SP - 720

EP - 722

BT - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

T2 - 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Y2 - 20 January 2010 through 23 January 2010

ER -

The packaging effect on high g accelerometer test

Abstract

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Conference

Keywords

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