The numerical value simulation studying of flip-chip thermal stress under temperature impulsion

Because of the complex of the geometry material, it is very hard to resolute the thermal stress distribution in Flip-Chip encapsulation, but the numerical value method, for instance finite element analysis, has been used in the studying of thermal stress and thermal strain. It is easy to model in 2D finite element, and the number of elements and nodes of the model are less which will make for the calculation continuously. It can improve the efficiency of numerical value method by using 2D finite element method in micro-system jointing. Aiming at the flip chip of no using and using the filling material, this paper adopt the finite element method to analysis the distribution of thermal stress and thermal strain under temperature loading, and analysis the devastating influence quantitatively and qualitatively.