Abstract
The novel solid MEMS switch can improve the performance of the MEMS initiator, which will be more secure and reliable.While the leads of its package are weak under launch environment. Therefore, this paper aims to carry out multi-physical field reliability analysis, by using FEM simulation analysis, which can simulate the real launch environment better and obtain the reliability and potential failure modes of leads in impact, temperature, current coupling field, thus providing theory reference for the design and application of the novel solid MEMS switch.
| Original language | English |
|---|---|
| Title of host publication | Micro-Nano Technology XV |
| Publisher | Trans Tech Publications Ltd. |
| Pages | 1404-1407 |
| Number of pages | 4 |
| ISBN (Print) | 9783038350712 |
| DOIs | |
| Publication status | Published - 2014 |
| Event | 15th Annual Conference and 4th International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2013 - Tianjin, China Duration: 3 Nov 2013 → 6 Nov 2013 |
Publication series
| Name | Key Engineering Materials |
|---|---|
| Volume | 609-610 |
| ISSN (Print) | 1013-9826 |
| ISSN (Electronic) | 1662-9795 |
Conference
| Conference | 15th Annual Conference and 4th International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2013 |
|---|---|
| Country/Territory | China |
| City | Tianjin |
| Period | 3/11/13 → 6/11/13 |
Keywords
- FEM simulation
- Failure
- Leads
- Mems switch
- Multi-physical field
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Fangyi, L., Wenzhong, L., Ying, W., & Fufu, W. (2014). The failure of the novel solid MEMS switch in multi-physical coupling field. In Micro-Nano Technology XV (pp. 1404-1407). (Key Engineering Materials; Vol. 609-610). Trans Tech Publications Ltd.. https://doi.org/10.4028/www.scientific.net/KEM.609-610.1404