Synchronous in-situ measurement for deformation and temperature fields with high spatial and temporal resolution under dynamic loading

Shengxin Zhu, Kai Yi, Heng Yang, Peng Zhao, Gongrong Deng, Haosen Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Studying the dynamic failure of materials is crucial because this failure occurs extensively in mechanics and earthquake fields. However, obtaining the deformation and temperature fields in high-speed dynamic cases is challenging, particularly when analyzing the mechanics of thermo-mechanical coupling. This study developed a thermo-mechanical coupled in-situ measurement system to acquire synchronized information on the load, deformation and temperature fields during a specimen dynamic failure process with high temporal and spatial resolution. In particular, the deformation field was obtained using a high-speed camera connected to a microscope that could achieve a spatial resolution of 3.6–3.8μm/pixel and a temporal resolution of 1μs. Moreover, a 64 × 64 focal plane array infrared detector was developed to measure temperatures with the time resolution of 1μs. A Newtonian optical system was applied to achieve the infrared detector's spatial resolution of 25μm. The temperature measurement system could measure temperatures ranging from 100 to 800 °C. The split-Hopkinson pressure bar was used as the dynamic loading device to realize the high strain rate loading of a Ti-6Al-4V hat-shaped specimen, verifying the deformation and temperature measurement capabilities. The results from the Ti-6Al-4V specimen under dynamic loading showed an evident adiabatic shear band and the temperature rise, suggesting that the experimental devices provided was an effective tool to study the thermo-mechanical response of materials under dynamic loading.

Original languageEnglish
Article number101954
JournalExtreme Mechanics Letters
Volume59
DOIs
Publication statusPublished - Mar 2023

Keywords

  • Adiabatic shear band
  • Dynamic loading
  • High temporal and spatial resolution
  • Synchronous measurement of deformation and temperature fields

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