TY - GEN
T1 - Surface-scattering-assisted Beam Scan for Terahertz Channel Alignment
AU - Li, Peian
AU - Wang, Jianchen
AU - Liu, Wenbo
AU - Ma, Jianjun
AU - Sun, Houjun
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Wireless communication technology operating at terahertz frequencies has been proposed as a potential candidate to support high spectral efficiency and high-speed data transmission. The use of high-gain, highly directional antennas help to extend its link distance effectively by overcoming free space path losses. But this also leads to difficulties in channel alignment due to its extremely narrow beam-width and small divergence angle. Employing non-line-of-sight (NLoS) path components, generated by surface scattering effect, can be a potential solution for wide channel coverage and efficient beam management. In this work we propose a method for channel alignment by using multi-path scattering components from a metallic wavy surface for channel scan and alignment. We find that the period of the surface and the incident angle are responsible for the efficiency and precision in channel scanning.
AB - Wireless communication technology operating at terahertz frequencies has been proposed as a potential candidate to support high spectral efficiency and high-speed data transmission. The use of high-gain, highly directional antennas help to extend its link distance effectively by overcoming free space path losses. But this also leads to difficulties in channel alignment due to its extremely narrow beam-width and small divergence angle. Employing non-line-of-sight (NLoS) path components, generated by surface scattering effect, can be a potential solution for wide channel coverage and efficient beam management. In this work we propose a method for channel alignment by using multi-path scattering components from a metallic wavy surface for channel scan and alignment. We find that the period of the surface and the incident angle are responsible for the efficiency and precision in channel scanning.
UR - http://www.scopus.com/inward/record.url?scp=85175617188&partnerID=8YFLogxK
U2 - 10.1109/ICMMT58241.2023.10277606
DO - 10.1109/ICMMT58241.2023.10277606
M3 - Conference contribution
AN - SCOPUS:85175617188
T3 - 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings
BT - 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023
Y2 - 14 May 2023 through 17 May 2023
ER -