Study on the impacts of pressure equalization slots on MHD flow and safety of FCI in DCLL blanket

Long Chen, Shi Jing Xu, Ming Jian Li, Ming Jiu Ni, Nian Mei Zhang*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

For a Dual Coolant Lead Lithium (DCLL) blanket, in order to reduce the pressure difference between inner and outer area of flow channel insert (FCI), which accounts for the stresses in FCI, the pressure equalization slots (PES) are proposed. In the present work, we aim at performing a direct simulation of the magneto-thermal-fluid–structure multi-physical fields in the DCLL blanket, with PES or not, by a coupled computing platform including CFD and the finite element method (FEM), to study the pressure field, velocity field, temperature field and deformation and stresses of FCI. A consistent and conservative scheme and PISO method on an unstructured collocated mesh are employed to solve the incompressible Navier–Stokes equations with the Lorentz force included. The FEM is applied to investigate the thermal strains and stresses of FCI structure. The results show that: (1) inserting FCI with low electrical conductivity and low thermal conductivity, the MHD pressure drop can be reduced and the heat transfer efficiency can be improved; (2) PES does not contribute significantly to pressure equalization. In addition, for case with PES, some potential structural failures and other problems would be caused, such as stress concentration; (3) for the case with PES, although the exit temperature of liquid metal is decreased, the heat transfer efficiency is increased and the max temperature of the first wall (FW) and the temperature difference across FCI wall are decreased.

Original languageEnglish
Pages (from-to)204-210
Number of pages7
JournalFusion Engineering and Design
Volume122
DOIs
Publication statusPublished - Nov 2017
Externally publishedYes

Keywords

  • DCLL blanket
  • FCI
  • Fluid–structure interaction
  • MHD effect
  • Thermal stress

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