TY - GEN
T1 - Study on preparation and dielectric properties of Nano Ni/SiC composite particles
AU - Xu, Hui
AU - Wang, Guo Xing
AU - Yu, Xi Chun
AU - Cao, Mao Sheng
PY - 2012
Y1 - 2012
N2 - In order to alleviate the glomeration of nanometer (SiC)p and improve its compatibility and performance, the chemical plating method was applied to get high-quality surface modification, and achieve the Ni/SiC composite particles. The dielectric and absorbing properties of the Ni/SiC particles were studied. The results showed that the modified SiC particles is nearly spherical, homogeneous morphology, and has a distinct core and shell parts. The different contrast of the shell indicated that more Ni is deposited on the (SiC) p surface, and the silicon carbide-nickel core-shell structure is formed. The dielectric constant, dielectric loss and magnetic permeability of the Ni/SiC composite particles have significant improvements compared with those of the original one. The dielectric constant rises about 24%, and R reaches-25.15dB when magnetic permeability up to 16.11GHz.
AB - In order to alleviate the glomeration of nanometer (SiC)p and improve its compatibility and performance, the chemical plating method was applied to get high-quality surface modification, and achieve the Ni/SiC composite particles. The dielectric and absorbing properties of the Ni/SiC particles were studied. The results showed that the modified SiC particles is nearly spherical, homogeneous morphology, and has a distinct core and shell parts. The different contrast of the shell indicated that more Ni is deposited on the (SiC) p surface, and the silicon carbide-nickel core-shell structure is formed. The dielectric constant, dielectric loss and magnetic permeability of the Ni/SiC composite particles have significant improvements compared with those of the original one. The dielectric constant rises about 24%, and R reaches-25.15dB when magnetic permeability up to 16.11GHz.
KW - (SiC)
KW - Dielectric properties
KW - Electroless plating
KW - Ni/SiC composite particles
UR - http://www.scopus.com/inward/record.url?scp=84863064863&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.151.218
DO - 10.4028/www.scientific.net/AMM.151.218
M3 - Conference contribution
AN - SCOPUS:84863064863
SN - 9783037853504
T3 - Applied Mechanics and Materials
SP - 218
EP - 221
BT - New Trends in Mechatronics and Materials Engineering
T2 - 2011 International Conference on Mechatronics and Materials Engineering, ICMME 2011
Y2 - 10 December 2011 through 12 December 2011
ER -