Study on dynamic fracture and mechanical properties of a PBX simulant by using dic and SHPB method

Zhongbin Zhou*, Pengwan Chen, Fenglei Huang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Citations (Scopus)

Abstract

The deformation and fracture of a PBX simulant were studied in this work. A pre-cracked semi-circular bending sample was loaded using a SHPB. The failure process of the sample was recorded in situ using a high speed camera. Based on the recorded images corresponding to the loading steps, the displacement and strain fields were determined using digital image correlation method. The crack opening displacement was determined. The correlation coefficient distribution was used to predict the initiation and propagation of the crack initiated from the tip of the pre-crack. In addition, the dynamic fracture toughness of the specimen was measured. The K IC values were approximately 1.39 ± 0.02, 1.51 ± 0.01 and 1.87 ± 0.03 MPa·m 1/2 corresponding to strain rates about 382 ± 13, 455 ± 8 and 621 ± 23 s -1, respectively. The fracture toughness results show strong strain rate dependence.

Original languageEnglish
Title of host publicationShock Compression of Condensed Matter - 2011 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
Pages665-668
Number of pages4
DOIs
Publication statusPublished - 2012
Event17th Biennial Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2011 APS SCCM - Chicago, IL, United States
Duration: 26 Jun 20111 Jul 2011

Publication series

NameAIP Conference Proceedings
Volume1426
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference17th Biennial Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2011 APS SCCM
Country/TerritoryUnited States
CityChicago, IL
Period26/06/111/07/11

Keywords

  • PBX simulant
  • SHPB
  • digital image correlation
  • dynamic fracture toughness
  • semicircular bending test

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