Selection of deposition chamber materials during the hot wall CVD preparation of platinum films

Selecting appropriate wall material is the key to reduce the consumption of precursor in the hot wall chemical vapor deposition process that is used to prepare platinum films so that the partial press of precursor could be maintained. In this paper, the ease of Pt films deposition was compared. The compared substrates were nickel-based superalloy, copper with oxide layer for the candidate of deposition chamber material and pure copper. The result shows that the copper with oxide layer is the hardest deposited in these experiments. Although the copper with oxide layer could be used as the substrate material in hot wall CVD, it can be used only one time.