TY - GEN
T1 - Research on thermal characteristics of electronic devices using thermal microscopes
AU - Gao, Lu
AU - Wang, Jihui
AU - Jin, Weiqi
AU - He, Xingdao
PY - 2010
Y1 - 2010
N2 - Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic devices design and reliability testing.
AB - Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic devices design and reliability testing.
KW - electronic devices
KW - nondestructive testing
KW - thermal characteristics
KW - thermal microscope imaging technology
UR - http://www.scopus.com/inward/record.url?scp=78650892599&partnerID=8YFLogxK
U2 - 10.1117/12.869621
DO - 10.1117/12.869621
M3 - Conference contribution
AN - SCOPUS:78650892599
SN - 9780819483843
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Infrared, Millimeter Wave, and Terahertz Technologies
T2 - Infrared, Millimeter Wave, and Terahertz Technologies
Y2 - 18 October 2010 through 20 October 2010
ER -