@inproceedings{ef06e95e354144d09e68c586b911d299,
title = "Reliability analysis of metalorganic chemical vapor deposition device",
abstract = "The metalorganic chemical vapor deposition (MOCVD) device is used for the growth of semiconductor materials. The reliability of MOCVD is vital to the safe operations of MOCVD. As a reliability analysis tool, failure mode and effects analysis (FMEA) can be used to assess the reliability of MOCVD. To deal with the difficulty of the weighting risk factors of FMEA, the weights of risk factors are obtained based on the technique for order preference by similarity to ideal solution (TOPSIS). The solenoid valve in the pipeline of MOCVD is analyzed as the case study. The results can support the risk management of MOCVD.",
keywords = "FMEA, MOCVDs, TOPSIS",
author = "Mengyao Geng and Huixing Meng and Weizhen Yao and Xianglin Liu",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 Annual Reliability and Maintainability Symposium, RAMS 2023 ; Conference date: 23-01-2023 Through 26-01-2023",
year = "2023",
doi = "10.1109/RAMS51473.2023.10088183",
language = "English",
series = "Proceedings - Annual Reliability and Maintainability Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 Annual Reliability and Maintainability Symposium, RAMS 2023",
address = "United States",
}