Recrystallized ice-templated electroless plating for fabricating flexible transparent copper meshes

Linhai Li, Qingrui Fan, Han Xue, Shizhong Zhang, Shuwang Wu, Zhiyuan He*, Jianjun Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

Flexible transparent conductors as a replacement for indium tin oxide (ITO) have been urgently pursued due to the inherent drawbacks of ITO films. Here, we report the fabrication of flexible transparent copper meshes with recrystallized ice-crystal templates. Completely different to conventional approaches, this novel method needs neither the fabrication of mesh patterns via micro/nanofabrication technologies nor the deposition of copper through evaporation or sputtering. The linewidth and mesh size of the prepared copper meshes can be regulated, as the ice recrystallization process is controllable. Therefore, the formed copper meshes have tailorable conductivity and transparency, which are critical for optoelectronic devices. Remarkably, the electrical performance of the copper meshes is maintained even after storing for 60 days in ambient conditions or bending for 1000 cycles. This strategy is modular and can also be employed to prepare other metal meshes, such as silver meshes, offering versatile substitutes for ITO in electronic devices.

Original languageEnglish
Pages (from-to)9894-9901
Number of pages8
JournalRSC Advances
Volume10
Issue number17
DOIs
Publication statusPublished - 9 Mar 2020
Externally publishedYes

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