TY - JOUR
T1 - Quantitative-regulated material removal rate in solid dielectric electrochemical polishing (QRR-SDEP) for smoothing high roughness surface of additively manufactured 316L stainless steel components
AU - Liu, Shenggui
AU - Li, Chaojiang
AU - Jin, Xin
AU - Jiang, Wang
AU - Cao, Xun
AU - Liu, Guodong
AU - Guo, Zilong
AU - Yang, Yu Xin
AU - Ong, Lawrence Chen Lym
N1 - Publisher Copyright:
© 2023 Elsevier B.V.
PY - 2023/7/5
Y1 - 2023/7/5
N2 - Despite the widespread adoption of metal additive manufacturing (AM) technologies across various industries, the high-performance requirements in precision scenarios make the optimization of surface quality for AM parts crucial. Herein, we present a quantitative-regulated material removal rate in solid dielectric electrochemical polishing (QRR-SDEP) method, which utilizes the impedance variation of solid dielectric to dynamically control the material removal rate (MRR) according to the evolution of the surface roughness. Based on quantitative analysis, MRR can be continuously regulated from tens of nm/min to several µm/min for three SDEP stages. Through modulating the MRR, laser powder bed fusion additively manufactured (AM-ed) surface with an initial roughness (Ra) of approximately 10 µm down to Ra= 0.75 µm (evaluation length 4 mm) and Sa= 0.66 µm (evaluation area 1220 ×1220 µm2) by employing an eco-friendly sulfate-free electrolyte. The improvement of Ra and Rz exceeds 92% and 94%, respectively. In addition, the evolution process of surface morphology and element compositions of polished AM-ed surfaces are discussed. The material removal mechanism of the QRR-SDEP process for high-roughness surfaces is also explained. Compared to conventional electrochemical polishing, QRR-SDEP achieves a leapfrog polishing from highly rough to submicron surfaces for intricate-shaped AM components without generating any waste electrolytes. As a result, QRR-SDEP will propel the extensive application of AM-ed metal components in precision engineering scenarios.
AB - Despite the widespread adoption of metal additive manufacturing (AM) technologies across various industries, the high-performance requirements in precision scenarios make the optimization of surface quality for AM parts crucial. Herein, we present a quantitative-regulated material removal rate in solid dielectric electrochemical polishing (QRR-SDEP) method, which utilizes the impedance variation of solid dielectric to dynamically control the material removal rate (MRR) according to the evolution of the surface roughness. Based on quantitative analysis, MRR can be continuously regulated from tens of nm/min to several µm/min for three SDEP stages. Through modulating the MRR, laser powder bed fusion additively manufactured (AM-ed) surface with an initial roughness (Ra) of approximately 10 µm down to Ra= 0.75 µm (evaluation length 4 mm) and Sa= 0.66 µm (evaluation area 1220 ×1220 µm2) by employing an eco-friendly sulfate-free electrolyte. The improvement of Ra and Rz exceeds 92% and 94%, respectively. In addition, the evolution process of surface morphology and element compositions of polished AM-ed surfaces are discussed. The material removal mechanism of the QRR-SDEP process for high-roughness surfaces is also explained. Compared to conventional electrochemical polishing, QRR-SDEP achieves a leapfrog polishing from highly rough to submicron surfaces for intricate-shaped AM components without generating any waste electrolytes. As a result, QRR-SDEP will propel the extensive application of AM-ed metal components in precision engineering scenarios.
KW - Electrochemical polishing
KW - Material removal rate
KW - Metal additive manufacturing
KW - Solid dielectric
KW - Surface roughness
UR - http://www.scopus.com/inward/record.url?scp=85164220518&partnerID=8YFLogxK
U2 - 10.1016/j.addma.2023.103689
DO - 10.1016/j.addma.2023.103689
M3 - Article
AN - SCOPUS:85164220518
SN - 2214-8604
VL - 73
JO - Additive Manufacturing
JF - Additive Manufacturing
M1 - 103689
ER -