Preparation of integrated carbon fiber stitched fabric reinforced (SiBCN) ceramic/resin double-layered composites for ablation resistance, thermal insulation and compression resistance performance

Chunlei Xia, Weihua Xie*, Songhe Meng, Bo Gao, Jinrui Ye*

*Corresponding author for this work

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Abstract

This paper reports a novel integrated carbon fiber fabric reinforced ceramic/resin double-layered composite. The composites were prepared by a low energy consumption process of stratified impregnate pyrolysis. The double-layered composites consist of an amorphous SiBCN ceramic upper layer and a SiBCN resin bottom layer. In the ablation experiment, the temperature of the composite material's ablated surface exceeded 1850 °C, while the temperature of the backside remained below 70 °C within 60 s of ablation. Even after 90 s of ablation, the backside temperature was still significantly lower than the theoretical application temperature of SiBCN resin. The ablated surface has no visible pits or cracks. The maximum mass ablation rate and line ablation rate were −0.01259 mg/s and 0.000933 mm/s, respectively. High-density amorphous SiBCN ceramic layer effectively play the role of high temperature and ablation resistance. In addition, the compressive strengths of the composites before and after ablation were above 340 MPa. Integrated composites that combine anti-ablation, insulation, and compression resistance have potential in aerospace applications.

Original languageEnglish
Article number110629
JournalComposites Science and Technology
Volume252
DOIs
Publication statusPublished - 16 Jun 2024

Keywords

  • Heat treatment
  • High-temperature properties
  • Hybrid composites
  • Multifunctional properties
  • SEM

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Xia, C., Xie, W., Meng, S., Gao, B., & Ye, J. (2024). Preparation of integrated carbon fiber stitched fabric reinforced (SiBCN) ceramic/resin double-layered composites for ablation resistance, thermal insulation and compression resistance performance. Composites Science and Technology, 252, Article 110629. https://doi.org/10.1016/j.compscitech.2024.110629