Abstract
Conductive silver paste was obtained using silver powder as the conductive filler and terpineol as the diluent in the F-type epoxy resin/methyl tetrahydrophthalic anhydride system. The effects of the type and content of the diluent, the curing temperature and curing time of the cured film on the performance of conductive silver paste were discussed by volume resistivity testing, SEM and infrared analysis. The results show that, the diluting effect of terpineol for conductive silver paste is excellent and the cured film with good adhesion and hardness can be obtained, and the optimum volume resistivity of 4.8×10-5 Ω∙cm is obtained when the content of terpineol is 8%. Volume resistivity decreases with increasing curing temperature when curing temperature is lower than 130℃, and no obvious decrease can be found when curing temperature is higher than 130℃. The electrical conductivity of the silver paste film can increase with increasing curing time when curing time is shorter than 40 min, and no obvious change can be found when curing time is longer than 40 min.
| Original language | English |
|---|---|
| Pages (from-to) | 481-486 |
| Number of pages | 6 |
| Journal | Fenmo Yejin Cailiao Kexue yu Gongcheng/Materials Science and Engineering of Powder Metallurgy |
| Volume | 22 |
| Issue number | 4 |
| Publication status | Published - 1 Aug 2017 |
| Externally published | Yes |
Keywords
- Conductive silver paste
- Film
- Low temperature curing
- Terpineol
- Volume resistivity