TY - GEN
T1 - Preparation and characterization of molecularly imprinted mesoporous organosilica for biphenol Z recognition and separation
AU - Yang, Shu
AU - Liu, Yun
AU - Yi, Huamin
AU - Sun, Liquan
AU - Luo, Aiqin
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/9/2
Y1 - 2015/9/2
N2 - Materials with large pore volume, fast binding kinetics and specific recognition are essential building blocks for sensors and assays. In this study, molecularly imprinted mesoporous organosilica (MIMO) was prepared by covalent surface imprinting methods with biphenol Z (BPZ) as template molecule and further characterized by FT-IR, TEM and N2 adsorption-desorption. Binding experiments results showed that MIMO has fast binding kinetics, good recognition for BPZ as compared to non-imprinted mesoporous organosilica (NIMO). Meanwhile, binding selectivity experiments demonstrated that MIMO had a high affinity to BPZ and BPA as compared to other structural analogues (BPS, catechol and resorcinol). Results demonstrate that MIMO has potential in sensor or separation application.
AB - Materials with large pore volume, fast binding kinetics and specific recognition are essential building blocks for sensors and assays. In this study, molecularly imprinted mesoporous organosilica (MIMO) was prepared by covalent surface imprinting methods with biphenol Z (BPZ) as template molecule and further characterized by FT-IR, TEM and N2 adsorption-desorption. Binding experiments results showed that MIMO has fast binding kinetics, good recognition for BPZ as compared to non-imprinted mesoporous organosilica (NIMO). Meanwhile, binding selectivity experiments demonstrated that MIMO had a high affinity to BPZ and BPA as compared to other structural analogues (BPS, catechol and resorcinol). Results demonstrate that MIMO has potential in sensor or separation application.
KW - biphenol Z
KW - mesoporous organosilica
KW - molecularly imprinted polymer
KW - selectivity
UR - http://www.scopus.com/inward/record.url?scp=84955327008&partnerID=8YFLogxK
U2 - 10.1109/ICMA.2015.7237617
DO - 10.1109/ICMA.2015.7237617
M3 - Conference contribution
AN - SCOPUS:84955327008
T3 - 2015 IEEE International Conference on Mechatronics and Automation, ICMA 2015
SP - 970
EP - 975
BT - 2015 IEEE International Conference on Mechatronics and Automation, ICMA 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th IEEE International Conference on Mechatronics and Automation, ICMA 2015
Y2 - 2 August 2015 through 5 August 2015
ER -