TY - GEN
T1 - Parametric Analysis and Efficient Optimization of Micro Thermal Convective Accelerometers with Excellent Sensitivity Using a Validated 1-D Model
AU - Wang, Xiaoyi
AU - Xu, Wei
AU - Lijin, Beiqi
AU - Ahmed, Moaaz
AU - Bermak, Amine
AU - Lee, Yi Kuen
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12/3
Y1 - 2018/12/3
N2 - We proposed a general T-dimensional (1D) and SPICE model for the parametric analysis and efficient optimization of Micro Thermoresistive Convective Accelerometers (MTCA). The validated sensor model with 6 key parameters can predict (1) the sensor output, sensitivity and power consumption, (2) the optimal distance (pmbDo) between microheater and thermoresisitve temperature sensors, (3) the overheat temperature (ΔTh=Th-pmbTa), (4) membrane thickness (t), (5) the depth of cavity (h). This proposed model can significantly reduce CPU time compared with CFD model by a factor of 1.16 million (10h/0.031s). The optimized MTCA using the engine oil as the working fluid can achieve the sensitivity of 1,680μ Vg, nearly 10 times higher than the best MTCA reported in the literature.
AB - We proposed a general T-dimensional (1D) and SPICE model for the parametric analysis and efficient optimization of Micro Thermoresistive Convective Accelerometers (MTCA). The validated sensor model with 6 key parameters can predict (1) the sensor output, sensitivity and power consumption, (2) the optimal distance (pmbDo) between microheater and thermoresisitve temperature sensors, (3) the overheat temperature (ΔTh=Th-pmbTa), (4) membrane thickness (t), (5) the depth of cavity (h). This proposed model can significantly reduce CPU time compared with CFD model by a factor of 1.16 million (10h/0.031s). The optimized MTCA using the engine oil as the working fluid can achieve the sensitivity of 1,680μ Vg, nearly 10 times higher than the best MTCA reported in the literature.
KW - ID theoretical model
KW - Micro Thermal Convective Accelerometer
KW - Prandtl Number
KW - Rayleigh Number
UR - http://www.scopus.com/inward/record.url?scp=85060296988&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2018.8556940
DO - 10.1109/NEMS.2018.8556940
M3 - Conference contribution
AN - SCOPUS:85060296988
T3 - NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
SP - 245
EP - 248
BT - NEMS 2018 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2018
Y2 - 22 April 2018 through 26 April 2018
ER -