@inproceedings{9337110e77b44723b36cb8633d1ecfa9,
title = "Numerical investigations on the grinding forces in ultrasonic assisted grinding of SiC ceramics by using SPH method",
abstract = "In this study, the grinding force variation mechanism in ultrasonic assisted grinding (UAG) of SiC ceramic is investigated by simulation method using a single diamond abrasive grain scratching. In simulation, the workpiece is modeled by smoothed particle hydrodynamic (SPH) method while the abrasive grain is modeled by finite element method (FEM). To reliably predict the grinding forces in UAG, an analytical model of average undeformed chip thickness ha is established. Grinding forces under different grinding parameters, i.e., depth of cut, and different ultrasonic vibration amplitudes are calculated by setting average undeformed chip thickness ha as scratching depth during SPH simulation process. The simulation results indicate that the normal force in UAG is reduced by about 20%, while the tangential force decreases up to 30% compared with those in conventional grinding (CG). The influences of grinding parameters and ultrasonic vibration on grinding forces will be investigated and the preliminary explanations will be presented.",
keywords = "Grinding, Grinding force, SiC ceramics, Smoothed particle hydrodynamic method (SPH), Ultrasonic assisted grinding (UAG)",
author = "Liang, {Zhi Qiang} and Mi, {Zhao Yang} and Wang, {Xi Bin} and Zhou, {Tian Feng} and Wu, {Yong Bo} and Zhao, {Wen Xiang}",
note = "Publisher Copyright: {\textcopyright} (2014) Trans Tech Publications, Switzerland.; 17th International Symposium on Advances in Abrasive Technology, ISAAT 2014 ; Conference date: 22-09-2014 Through 25-09-2014",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.1017.735",
language = "English",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications Ltd.",
pages = "735--740",
editor = "Jiwang Yan and Hideki Aoyama and Akinori Yui",
booktitle = "Advances in Abrasive Technology XVII",
address = "Switzerland",
}